ZEMSIL SL-CMP
≡ Cabot Microelectronics SS25CMP-Grade Colloidal Silica Slurry
CAS 7631-86-9
同等替代： Fujimi GLANZOX 3900
申请报价
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25
%
SiO₂ Content
70–100
nm
Particle Size (DLS)
9–11
pH
Milky white slurry
Appearance
技术指标
| 指标 | 数值 | 单位 |
|---|---|---|
| SiO₂ Content | 25 ± 1 | % |
| Particle Size (DLS, D50) | 70–100 | nm |
| pH | 9.0–11.0 | — |
| Na₂O Content | ≤0.1 | % |
| Metal Ion Content | <1 | ppm (total) |
| Specific Gravity @ 25°C | 1.15–1.18 | — |
应用领域
Chemical mechanical polishing (CMP) of SiO₂ dielectric layers on 300 mm wafersTungsten (W) CMP planarization in back-end-of-line semiconductor processingHigh-precision glass substrate polishing for hard disk drive plattersSapphire and quartz substrate surface finishing
主要特点
- —Narrow particle size distribution for consistent and predictable material removal rate
- —Ultra-low total metal ion content below 1 ppm — critical for semiconductor cleanliness requirements
- —Filtration-ready formulation compatible with 300 mm wafer fab point-of-use filtration systems
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